Thin-film transistor

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

Other Related Categories

357 4, 357 2, H01L 2978

Type

Patent

Status

active

Patent number

048622346

Description

ABSTRACT:
A thin-film transistor comprising an insulating substrate; an opaque metal gate electrode disposed on a portion of said insulating substrate; a gate insulating layer disposed on said insulating substrate including said gate electrode; an a-Si semiconductor film disposed on the portion of said gate insulating layer, said a-Si semiconductor film having been formed to attain self-alignment with respect to said gate electrode; a-Si contact films constituting source and drain regions, respectively, with a gap therebetween disposed on said a-Si semiconductor film, the outer end of each of said contact films being formed to attain self-alignment with respect to said gate electrode; source and drain electrodes, respectively, disposed on said source and drain regions, the thickness of each of said a-Si semiconductor film and said a-Si contact film being 100 .ANG. or more and the total amount of thicknesses thereof being 1,000 .ANG. or less.

REFERENCES:
patent: 4425572 (1984-01-01), Takafuji
patent: 4609930 (1986-09-01), Yamazaki
patent: 4746628 (1988-05-01), Takafuji
patent: 4752814 (1988-06-01), Tuan
patent: 4757361 (1988-07-01), Brodsky

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Thin-film transistor does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thin-film transistor, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thin-film transistor will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2242954

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.