Electroplating current control

Chemistry: electrical and wave energy – Processes and products

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

204211, 204228, C25D 706, C25D 1700

Patent

active

042408814

ABSTRACT:
An automatic plating current control system for an electroplating line. The plating line includes a plurality of power circuits, each including a rectifier and an electrode, for delivering plating current to affect electrodeposition on the workpiece surface.
The automatic control system includes a reference generator, a first feedback circuit for controlling the total plating current applied by all the power circuits and a plurality of second feedback circuits each associated with a different power circuit. Each of the second feedback circuits co-operates with the first feedback circuit for regulating plating current output of the individual power circuits to apportion the current output among the operative power circuits. The reference generator produces a reference signal representing a desired plating current in response to information input to the reference generator, specifying workpiece speed, workpiece dimension and desired plating thickness.
Each power circuit includes an output voltage control and a current metering circuit. The voltage control circuitry is provided for each power circuit to limit its plating current output to a predetermined maximum without disabling the power circuit. Compensation circuitry is provided for altering the reference signal for varying the fraction of plating current apportioned to each power circuit to compensate for inoperability of one or more power circuits.

REFERENCES:
patent: 2463254 (1949-03-01), Edwards
patent: 2471912 (1949-05-01), Stoltz
patent: 2494852 (1950-01-01), Winterhalter
patent: 2603595 (1952-07-01), Rendel
patent: 2734858 (1956-02-01), Bachman
patent: 3061534 (1962-10-01), Jasperson
patent: 3371231 (1968-02-01), Burley
patent: 3564293 (1971-02-01), Mungenast
patent: 3577335 (1971-05-01), Blitchington, Jr.
patent: 3622849 (1971-11-01), Kelley, Jr.
patent: 3723285 (1973-03-01), Daga
patent: 3887452 (1975-06-01), Mannaka
patent: 3962048 (1976-06-01), Gilbert

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Electroplating current control does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electroplating current control, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electroplating current control will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2241197

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.