Tape bonding material and structure for electronic circuit fabri

Details Tape bonding material and structure for electronic circuit fabri Tape bonding material and structure for electronic circuit fabri

1986-07-25

1988-04-05

Edlow, Martin H.

357 68, 357 69, 357 71, H01L 2348

Patent

active

047362367

ABSTRACT:
An electronic circuit assembly is disclosed including a semiconductor die having an aluminum therminal pad on its top surface. A lead frame is disposed adjacent the semiconductor die and is adapted to be electrically connected to the die. An electrical connection device interconnects the terminal pad to the lead frame. The electrical connection device includes a biclad transport tape comprising a first member formed from a nickel containing material and a second member formed from a copper containing material. The transport tape is disposed in the electronic circuit assembly with its first member bonded to the terminal pad and its second member bonded to the lead frame. The transport tape may be constructed so as to efficiently dissipate heat from the semiconductor die.

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