Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor
Patent
1979-06-29
1981-01-13
Tolin, Gerald P.
Electricity: electrical systems and devices
Electrostatic capacitors
Fixed capacitor
361385, 361386, 357 82, H05K 720
Patent
active
042452732
ABSTRACT:
A package for mounting, interconnecting, and cooling a large number of integrated circuit semiconductor devices having a sintered multilayer ceramic substrate provided with an internal metallurgy network made up of voltage planes, X and Y signal planes, and fan-out planes, with I/O pins on the bottom surface, and a plurality of asymmetrical solder pad clusters for flip chip bonding to a plurality of integrated circuit devices on the top surface, a plurality of integrated circuit devices bonded to the solder pad clusters, at least one row elongated engineering change pads surrounding each pad cluster, each pad provided with a severable surface link, the I/O pins connected to the internal network of the substrate and arranged in clusters with the powering voltages of each device located directly beneath the device thereby minimizing voltage drop, and signal voltages inputted through the I/O pins interspersed between the clusters of power pins, a cap for forming an enclosure over at least the top surface of the ceramic substrate, and a liquid cooling means associated with the cap for removing heat from the devices.
REFERENCES:
patent: 3564114 (1971-02-01), Blinder
patent: 3643133 (1972-02-01), Towell
patent: 3726002 (1973-04-01), Greenstein
patent: 3838204 (1974-09-01), Ahn
patent: 3851221 (1974-11-01), Beanliew et al.
patent: 3993123 (1976-11-01), Chu et al.
patent: 3999004 (1976-12-01), Chirino
patent: 4047132 (1977-09-01), Krojewski
patent: 4150421 (1979-04-01), Nishihara
Integrated Circuit Int. & Packaging, IBM Tech. Discl. Bull., Finch et al., vol. 13, No. 4 Sep. 1970, p. 962.
A Fabrication Technique For Multilayer Ceramic Modules, Kaiser et al., Solid State Techn. May 1972, p. 35.
Feinberg Irving
Langdon Jack L.
International Business Machines - Corporation
Stoffel Wolmar J.
Tolin Gerald P.
LandOfFree
Package for mounting and interconnecting a plurality of large sc does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Package for mounting and interconnecting a plurality of large sc, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Package for mounting and interconnecting a plurality of large sc will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2234296