Alignment of an object

Details Alignment of an object Alignment of an object

1988-11-15

1989-08-29

Evans, F. L.

Optics: measuring and testing

By alignment in lateral direction

With registration indicia

356400, 250548, 250557, 355 53, 355 77, G01B 1100

Patent

active

048611620

ABSTRACT:
A method of sequentially positioning different regions of a semiconductor wafer, onto each of which regions an image is to be transferred at a transfer station, the method comprising the steps of: detecting, at a non-transfer station, positions of the different regions of the wafer with respect to a reference mark; detecting, at the transfer station, a position of the reference mark with respect to a standard mark; detecting positions of the different regions of the wafer with respect to the standard mark on the basis of the detection of the position of the reference mark with respect to the standard mark and the detection of the positions of the different regions of the water with respect to the reference mark; and moving the wafer so as to sequentially place the different regions thereof at the transfer station while controlling the movement of the wafer, for the sequential placing, in accordance with the detection of the positions of the different regions of the wafer with respect to the standard mark, whereby the different regions of the wafer are sequentially and accurately positioned with respect to the standard mark.

REFERENCES:
patent: 4469949 (1984-09-01), Mori et al.
patent: 4540277 (1985-09-01), Mayer et al.
patent: 4642468 (1987-02-01), Tabata et al.
Fiore et al., IBM Technical Disclosure Bulletin, vol. 13, No. 12, May 1971, p. 3651.

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