Method for producing a ceramic member having fine throughholes

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

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Details

156252, 156253, 347123, B32B 3126, C04B 35486

Patent

active

058939547

ABSTRACT:
A method for producing a ceramic member having fine throughholes, includes the steps of: producing a first green sheet for a thin ceramic plate; forming a plurality of fine throughholes having a minimum diameter of 150 .mu.m or less after firing in the first green sheet and having a minimum distance of 150 .mu.m or less between two of the throughholes after firing, the throughholes being disposed zigzag; producing a second green sheet to be used for a ceramic substrate; forming at least one window portion in the second green sheet; laminating the first green sheet on the second green sheet for obtaining a unitary laminate so that the plurality of fine throughholes in the first green sheet match the window portion(s) of the second green sheet; and firing the laminate so as to obtain a unitary sintered body; wherein a shorter side (maximum width) W of the window portion of the ceramic substrate satisfies the formula: W(mm).gtoreq.0.01/d, wherein d is the minimum distance between two of the throughholes after firing. Alternatively, the throughholes can be formed in the first green sheet after it is laminated with the second green sheet.

REFERENCES:
patent: 4799070 (1989-01-01), Nishikawa
patent: 5517076 (1996-05-01), Takeuchi et al.
patent: 5728244 (1998-03-01), Nanataki et al.

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