Wafer method for breaking a semiconductor

Details Wafer method for breaking a semiconductor Wafer method for breaking a semiconductor

1994-11-21

1996-06-18

Thomas, Tom

Fishing, trapping, and vermin destroying

437227, 148DIG28, H01L 21301

Patent

active

055277446

ABSTRACT:
A process for partially sawing the streets on semiconductor wafers. After sawing the streets can be covered by a protective material, and then the wafer continues its processing as before. After the wafer is broken, the protective material may or may not be removed. Additionally, the wafer may be broken into individual chips using a wedge piece that has a number of individual wedges on it, where the individual wedges press against the partially sawn streets, causing the wafer to break.

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