Thermoplastic resin compositions

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – At least one aryl ring which is part of a fused or bridged...

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Details

524506, 524588, 524602, C08L 5108

Patent

active

053228812

DESCRIPTION:

BRIEF SUMMARY
TECHNICAL FIELD

The present invention relates to a thermoplastic resin composition in which a thermoplastic resin such as a polyamide resin, polymethacrylimide resin and polyetherimide resin (hereinafter referred to as polyamide resin and the like) has been improved in impact resistance while maintaining its mechanical properties such as strength, stiffness and the like.


BACKGROUND ART

Hitherto, there have been proposed many methods for improving the impact resistance of thermoplastic resins such as polyamide resin and the like. For example, a method of blending a thermoplastic resin and a polyorganosiloxane graft copolymer, which is described in Japanese Patent Application Kokai No. 61-235462 and No. 2-1763, is a relatively good method. In this method, however, dispersion of the polyorganosiloxane graft copolymer depends upon interaction between the polymer constituting the outermost layer of the graft copolymer and the matrix resin, so that there is a case wherein an improvement in impact strength is insufficient depending upon properties of the matrix resin. Consequently, resin compositions developing a higher impact resistance are being demanded.
In view of the situation as mentioned above, the present inventors have extensively, studied to improve the impact resistance of polyamide resins, polymethacrylimide resins and polyetherimide resins over a wider temperature range. As a result, the present inventors have found that thermoplastic resin compositions having improved impact resistance over a wider temperature range and also being superior in heat resistance, appearance of molded product and adhesion property cf paint film are obtained by blending these thermoplastic resins with a polyorganosiloxane graft copolymer obtained by graft-polymerizing one or more kinds of vinyl monomer onto a polyorganosiloxane rubber or a polyorganosiloxane compound rubber having such a structure that the polyorganosiloxane rubber component and polyalkyl (meth)acrylate rubber component cannot be separated from each other, and an organic silane compound having an epoxy group. The present inventors thus attained to the present invention.


DISCLOSURE OF INVENTION

The gist of the present invention is a thermoplastic resin composition comprising (A) 60 to 99 parts by weight of at least one thermoplastic resin selected from the group consisting of polyamide resins, polymethacrylimide resins and polyetherimide resins, (B) 1 to 40 parts by weight of a polyorganosiloxane graft copolymer obtained by graft-polymerizing one or more kinds of vinyl monomer onto a polyorganosiloxane rubber or a polyorganosiloxane compound rubber having such a structure that the polyorganosiloxane rubber component and polyalkyl (meth)acrylate rubber component cannot be separated from each other, the total amount of both the components (A) and (B) being 100 parts by weight, and (C) 0.01 to 10 parts by weight of an organic silane compound having an epoxy group, and if necessary, a filler (D) in an amount of 10 to 300 wt.% based on the total amount of (A), (B) and (C).


BEST MODE FOR CARRYING OUT THE INVENTION

The polyamide resin used in the present invention includes polyamides obtained from an aliphatic, aromatic or alicyclic dicarboxylic acid and a diamine, and polyamides obtained from aminocarboxylic acids or cyclic lactams. Preferred specific examples include nylon 6, nylon 12, nylon 6.multidot.6, nylon 4.multidot.6, nylon MXD 6, nylon 6/10 copolymer, nylon 6/66 copolymer and the like. Particularly, nylon 6 and nylon 66 are preferably used.
The polymethacrylimide resin preferably used in the present invention includes those containing 5 wt.% or more of a cyclic structure unit represented by the formula (1), ##STR1## wherein R.sup.1 represents a hydrogen atom, a C.sub.1 -C.sub.20 alkyl group, a C.sub.6 -C.sub.20 cycloalkyl, aryl, allyl or alkenyl group, or a C.sub.7 -C.sub.20 aralkyl group. Any polymer will do if it contains the above cyclic structure unit. Generally, however, those in which R.sup.1 is a hydrogen atom or a methyl, ethyl, propyl

REFERENCES:
patent: 4902742 (1990-02-01), Yamamoto et al.
patent: 5011887 (1991-04-01), Sasaki et al.
patent: 5147947 (1992-09-01), Yamamoto et al.

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