Semiconductor defects curing method and apparatus

Fishing – trapping – and vermin destroying

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437 4, 437170, 437228, H01L 3118

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active

047255587

ABSTRACT:
An improved semiconductor defects curing method and apparatus are disclosed which is free from current leakage due to pin-holes or other defects. Also an improved method for processing a semiconductor device is shown. According to the invention, the gaps or holes in the semiconductor layer produced in the fabrication process are filled with insulator in advance of deposition of electrodes.

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patent: 4544797 (1985-10-01), Hewig
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