Microstrip circuit temperature compensation with stub means

Communications: radio wave antennas – Antennas – Microstrip

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333246, H01Q 138

Patent

active

046546685

ABSTRACT:
In order to achieve temperature compensation in a microstrip linear array, the array is periodically loaded by means of a plurality of open circuited stubs coupled to the main transmission line through tightly controlled gap dimensions to provide increasing shunt susceptance which compensates for the decease in shunt susceptance of the line as temperature increases.

REFERENCES:
patent: 2819452 (1958-01-01), Arditi et al.
patent: 3534301 (1970-10-01), Golembeski
patent: 4079268 (1978-03-01), Fletcher et al.
patent: 4296416 (1981-10-01), Harader

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