Multilayer article having a planarized outer layer comprising a

Details Multilayer article having a planarized outer layer comprising a Multilayer article having a planarized outer layer comprising a

1994-11-23

1996-06-18

Raimund, Christopher W.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428901, B32B 300

Patent

active

055275923

ABSTRACT:
An electronic circuit package comprising an electrically conductive circuit layer on a polymer, ceramic or multi-layer substrate wherein a curable dielectric material is applied over the electrically conductive circuit layer. The curable dielectric material comprises a blend of a fluorine-containing cyanate and a fluorine-containing arylene ether polymer. The cyanate is a monomer having the structure

REFERENCES:
patent: 4745215 (1988-05-01), Cox et al.
patent: 4902752 (1990-02-01), Shimp

Affiliated with

Also associated with

Rating

Multilayer article having a planarized outer layer comprising a does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multilayer article having a planarized outer layer comprising a , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multilayer article having a planarized outer layer comprising a will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-221493