Semiconductor packaging method

Details Semiconductor packaging method Semiconductor packaging method

1998-12-03

2000-09-05

Chaudhari, Chandra

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Insulative housing or support

438113, 438977, 257621, 257684, H01L 2144, H01L 2148, H01L 2150, H01L 2940, H01L 2306

Patent

active

061141917

ABSTRACT:
Semiconductor devices 340 are formed in semiconductor wafer 300. Contact pads 332 are formed in each die 330. An interconnect connects the contact pads 332 to die surface contact regions 210, 212. Scribe trenches 348 are formed in device wafer 300; corresponding trenches 358 are formed in cover wafer 360. The cover wafer 360 is thinned to open scribe trenches 348. Conductive vias 310-313 connect the contact pads 210, 212 to external surface bump contacts 333.

REFERENCES:
patent: 4905075 (1990-02-01), Temple
patent: 5346861 (1994-09-01), Khandros
patent: 5518964 (1996-05-01), DiStefano
patent: 5585310 (1996-12-01), Temple
IEDM, 1986, pp. 184-187, XP002039418, S. Sugiyama, et al.: "Micro-diaphragm Pressure Sensor", p. 184, col. 2, line 37--p. 185, line 32; figure 3.

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