Method of forming heat sink and semiconductor chip assemblies

Details Method of forming heat sink and semiconductor chip assemblies Method of forming heat sink and semiconductor chip assemblies

1998-04-14

2000-09-05

Everhart, Caridad

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

438123, 438124, H01L 2144

Patent

active

061141909

ABSTRACT:
Methods for applying a heat sink to a semiconductor chip. A heat sink frame is removably attached to one or more heat sinks and is used to align the heat sinks with corresponding semiconductor chips. The semiconductor chips are preferably positioned on a semiconductor chip frame. The heat sinks are aligned with the semiconductor chips either before or after the semiconductor chips are substantially encapsulated within a molding material. The heat sink frame is detached from the heat sinks at a selected time after the heat sinks and the semiconductor chips have been aligned, whereby the heat sinks remain combined with the semiconductor chips. Detachment of the heat sink frame may be conducted before or, alternatively, after the semiconductor chips have been encapsulated. The methods of the invention facilitates the efficient and reliable application of heat sinks to semiconductor chips.

REFERENCES:
patent: 5065281 (1991-11-01), Hernandez et al.
patent: 5106451 (1992-04-01), Kan et al.
patent: 5482898 (1996-01-01), Marrs

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