Etching a substrate: processes – Forming or treating thermal ink jet article
Patent
1998-06-03
2000-06-06
Gulakowski, Randy
Etching a substrate: processes
Forming or treating thermal ink jet article
438 21, 347 50, B41J 2035, H01R 3400, G11B 5127
Patent
active
060714271
ABSTRACT:
The invention described in the specification relates to an improved method for making a printhead for an ink jet printer. In the method, one or more semiconductor substrates containing energy imparting devices for ink and electrical conductors for the energy imparting devices are attached to a metal substrate carrier. A conductive layer containing electrical tracing terminating in contact pads is also attached to the carrier using an adhesive. A nozzle plate is attached to the conductive layer and to the semiconductor substrate also using an adhesive. The nozzle plate, conductive layer and adhesive all have openings or windows therein for use in forming wire bonds between the semiconductor substrate and the conductive layer. Once the wire bonds having loops are formed, the wire loops are depressed toward the nozzle plate to reduce the height of the loops above the nozzle plate. The entire wires and bonds are then encapsulated in a elastomeric, insulative material to protect the wires. An advantage of the depressed wire loops is that the encapsulating material layer may be relatively thin so that it does not extend above the exposed surface of the nozzle plate more than about 15 mils thereby providing maximum clearance between the printhead a media to be printed.
REFERENCES:
patent: 4881318 (1989-11-01), Komura et al.
patent: 4901091 (1990-02-01), Kasamoto
patent: 4989317 (1991-02-01), Firl et al.
patent: 5016023 (1991-05-01), Chan et al.
patent: 5132707 (1992-07-01), O'Neill
patent: 5278584 (1994-01-01), Keefe et al.
patent: 5300959 (1994-04-01), McClelland et al.
patent: 5315472 (1994-05-01), Fong et al.
patent: 5410340 (1995-04-01), Drake et al.
patent: 5442384 (1995-08-01), Schantz et al.
patent: 5515089 (1996-05-01), Herko et al.
patent: 5519421 (1996-05-01), Barr et al.
patent: 5528272 (1996-06-01), Quinn et al.
patent: 5538586 (1996-07-01), Swanson et al.
patent: 5565901 (1996-10-01), Hawkins
Ahmed Shamim
Gulakowski Randy
Lexmark International Inc.
Sanderson Michael T.
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