Material-saving resist spinner and process

Details Material-saving resist spinner and process Material-saving resist spinner and process

1994-01-25

1995-01-03

Bell, Janyce

Coating processes

Direct application of electrical, magnetic, wave, or...

Sonic or ultrasonic

427240, 427299, 427377, 4273855, B05D 312

Patent

active

053785118

ABSTRACT:
Spin coating of resist on a semiconductor wafer is done in a controlled chamber, starting with introducing a resist solvent vapor into the chamber from a nozzle or an adjacent chamber, applying the resist by spraying a very thin layer of the resist material and then removing solvent from the chamber. The result is a saving in resist material and enhanced coating uniformity.

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patent: 4806455 (1989-02-01), LaBianca
patent: 5264246 (1993-11-01), Ikeno
K. Skidmore, "To Obtain Photoresist Films With The Characteristics Necessary For Fabricating VLSI/ULSI ICs, An Understanding And Control Of Many Parameters Is Required" Semiconductor International, pp. 57-62 (Feb. 1988).

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