Metal fusion bonding – Process – Using only pressure
Patent
1994-01-31
1995-01-03
Ramsey, Kenneth J.
Metal fusion bonding
Process
Using only pressure
228 18, 228 563, 228176, H01L 2158, B23K 3514
Patent
active
053778995
ABSTRACT:
Of two sheet-like solder stocks, one sheet-like solder stock is fed at a constant speed, and additive particles having a constant particle diameter are spread on an upper surface of the one solder material sheet in a quantitative fixed quantity. The other sheet-like solder stock is stacked on the upper surface of the one sheet-like solder stock, and the two stacked solder stocks are rolled and integrally laminated by rollers. The laminated solder sheet is cut into a plurality of narrow solder strips. Each of the solder strips is wound on a reel, and supplied as a die bonding material capable of being used for the die bonding. Thus, if this solder is used for a semiconductor chip die bonding, the unevenness in thickness of the solder layer directly under the die-bonded semiconductor chip becomes small, and it is possible to minimize the error in the semiconductor chip recognition in the case of the wire bonding.
REFERENCES:
patent: 3163499 (1964-12-01), Bray
patent: 3620880 (1971-11-01), Lemelson
patent: 4020987 (1977-05-01), Hascoe
patent: 4423120 (1983-12-01), Paulus et al.
NEC Corporation
Ramsey Kenneth J.
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