Method of making flip-chip microwave integrated circuit

Details Method of making flip-chip microwave integrated circuit Method of making flip-chip microwave integrated circuit

1995-06-07

1997-03-25

Niebling, John

Fishing, trapping, and vermin destroying

437902, H01L 2160

Patent

active

056144423

ABSTRACT:
A flip-chip integrated circuit 1100 having a transistor 1108 formed at a frontside surface of a substrate 1104. An airbridge 1106 may be formed over portions of the transistor wherein a top surface of the airbridge is spaced from the frontside surface by a distance approximately equal to, or greater than, the thickness of the substrate. The circuit may also include a transmission line 1114 at the frontside surface and a heatsink 1102 coupled to the airbridge.

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patent: 5373185 (1994-12-01), Sato
W. S. Wong, W. D. Gray, and D. C. Wang, "Flip Chip Manufacturing Technology for GaAs MMIC", Hughes Aircraft Company, Microelectronic Circuits Division, GaAs Mantech, Conf., pp. 224-227.

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