Non-reclosable packages containing desiccant matrix

Details Non-reclosable packages containing desiccant matrix Non-reclosable packages containing desiccant matrix

1996-06-28

2000-09-05

Ackun, Jacob K.

Special receptacle or package

With moisture absorbent

53111R, B65D 8500

Patent

active

061128880

ABSTRACT:
A substantially solvent-free molten or fluid desiccant/organic matrix composition is adhered to a package whereby the desiccant is in communication with a compartment of the resulting package such that the compartment is desiccated by the desiccant composition. The desiccant composition preferably contains a thermoplastic organic matrix, is heated before it is adhered to the package, and cools after application. In some instances, the desiccant matrix may be adhered to a component of the package contents. The package is preferably non-reclosable and suitable for holding an article such as a drug, medical device or electronic device.

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