Process for producing a printed circuit board

Details Process for producing a printed circuit board Process for producing a printed circuit board

1993-11-29

1995-01-03

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

1566591, 156902, 427 96, H05K 302

Patent

active

053774060

ABSTRACT:
A process for producing a printed circuit board is disclosed, in which use is made of a copper-clad laminate comprising a substrate and, superimposed thereon, a copper foil having its entire surface covered with a solder foil. A solder foil 4 is applied to cover the entire surface of a copper foil 2 superimposed on a substrate 1 (the copper foil 2 and the substrate 1 forming a copper-clad laminate 3). An etching resist is applied to the surface of the solder foil 4, and the solder foil 4 and the copper foil 2 are simultaneously etched to form a conductor circuit pattern 8. Thereafter, the etching resist is stripped off, and unneeded portions of the solder foil 4 are removed on the conductor circuit pattern 8 to thereby produce a printed circuit board. The above process of the invention facilitates soldering operation for the printed circuit board and reduces the production cost thereof.

REFERENCES:
patent: 4049481 (1977-09-01), Morisaki
patent: 4512829 (1985-04-01), Ohta et al.
patent: 4756795 (1988-07-01), Bakos et al.
patent: 4804615 (1989-02-01), Larson et al.
patent: 4925522 (1990-05-01), Avellino et al.
patent: 5200026 (1993-04-01), Okabe

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