Method for making metallized capacitor having increased dielectr

Details Method for making metallized capacitor having increased dielectr Method for making metallized capacitor having increased dielectr

Filed on

1994-07-29

Date issued

1997-03-25

Examiner

Ledynh, Bot L.

Patent Class

Electric heating

SubClass

Metal heating

SubSubClass

By arc

Other Related Categories

29 2542, 437919, 427569, B23K 900, H01G 700

Type

Patent

Status

active

Patent number

056141114

Description

ABSTRACT:
A metallized film capacitor in which the metallization is made as thin as possible in order to increase the dielectric strength of the film. In the industry, typical metallization thicknesses range from approximately 1-4 ohms/sq, however, the present invention employs thicknesses which range from 5-300 ohms/sq. And, depending on which thickness is used, the effective dielectric strength of the film can be substantially increased. Additionally, the capacitor or various components thereof are exposed to a gas plasma for further increasing the dielectric breakdown voltage.

REFERENCES:
patent: 3185907 (1965-05-01), McKee et al.
patent: 3457478 (1969-07-01), Lehrer
patent: 3602770 (1971-08-01), McMahon
patent: 3644805 (1972-02-01), Heywang
patent: 4470097 (1984-09-01), Lavene
patent: 4477858 (1984-10-01), Steiner
patent: 4516187 (1985-05-01), Lavene
patent: 5305178 (1994-04-01), Binder

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