Method of producing a semiconductor device using an expand tape

Details Method of producing a semiconductor device using an expand tape Method of producing a semiconductor device using an expand tape

1997-06-06

1998-06-09

Simmons, David A.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156344, 156584, 437266, B32B 3112, B32B 3118, H01L 2100

Patent

active

057627444

ABSTRACT:
A method of producing a semiconductor device wherein a metal preform layer is applied to an expand tape followed by a step of adhering a wafer to the metal preform layer using an adhesive layer of a thin adhesive sheet on the preform layer. The metal preform layer and the wafer are cut into chips wherein each chip has adhered to the bottom a cut piece of the metal preform layer. The expand tape is then expanded to separate adjacent chips from each other, and each chip is then removed from the expanded expand tape and then die-bonded to a lead frame.

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patent: 5030308 (1991-07-01), Sheyon et al.
patent: 5110388 (1992-05-01), Komiyama et al.
patent: 5275958 (1994-01-01), Ishikawa
patent: 5476565 (1995-12-01), Akada et al.

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