Semiconductor device package with solder bump electrical connect

Details Semiconductor device package with solder bump electrical connect Semiconductor device package with solder bump electrical connect

1992-07-28

1993-09-28

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

174255, 257778, 361744, 361783, 361807, 361820, H02B 0000

Patent

active

052490980

ABSTRACT:
Wells are formed in an external surface of a semiconductor device package body. Capacitors are disposed within the wells at least partially, and preferably fully within the body. Cleaning channels are formed underneath the capacitors, for removing residual flux and/or solder.

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