Flip chip encapsulating compositions and semiconductor devices e

Details Flip chip encapsulating compositions and semiconductor devices e Flip chip encapsulating compositions and semiconductor devices e

1992-05-28

1993-09-28

Marquis, Melvyn I.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

528 21, 528 27, C08L 6302

Patent

active

052487105

ABSTRACT:
A composition comprising (A) an epoxy resin having at least two epoxy groups in a molecule, (B) a silicone-modified epoxy resin, (C) an imidazole curing agent having a solubility of up to 0.1% by weight in epoxy resin (A) at 25.degree. C., and (D) fused silica having a mean particle size of up to 10 .mu.m and adjusted to a viscosity of up to about 4,000 poise at 25.degree. C. satisfies the requirements for flip chip encapsulation since the composition has improved shelf stability and filling ability and cures into products having improved moisture resistance. Semiconductor devices encapsulated with cured products of the composition remain reliable because of moisture resistance.

REFERENCES:
patent: 5053445 (1991-10-01), Itoh et al.
patent: 5096762 (1992-03-01), Yoshida et al.

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