Excavating
Patent
1993-03-23
1995-08-15
Voeltz, Emanuel T.
Excavating
371 221, 371 223, 371 226, 324158R, G01R 3128
Patent
active
054426430
ABSTRACT:
An integrated circuit (IC) chip which can be tested even after being packaged on a circuit board together with other IC chips, and a method of testing such IC chips on the circuit board are provided. The IC chip has a main IC section to which a particular function is assigned, and a plurality of testing circuits capable of freely extracting output data of the main IC section on a common bus. An interface is also provided on the IC chip which receives signals for controlling the testing circuits from the outside. The testing circuits, therefore, can selectively hold data sent from the outside or data from the main IC section and then send the data out via input/output terminals thereof or the interface.
REFERENCES:
patent: 3082374 (1963-03-01), Buch
patent: 4099668 (1978-07-01), Feilchenfeld et al.
patent: 4348759 (1982-09-01), Schnurmann
patent: 4395767 (1983-07-01), Van Brunt et al.
patent: 4701922 (1987-10-01), Kuboki et al.
patent: 5084874 (1992-01-01), Whetsel, Jr.
patent: 5189365 (1993-02-01), Ikeda et al.
patent: 5214655 (1993-05-01), Eichelberger et al.
Fuji Photo Film Co. , Ltd.
Tran Alan
Voeltz Emanuel T.
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