Multi-layer electrical interconnection method

Details Multi-layer electrical interconnection method Multi-layer electrical interconnection method

1996-06-10

1998-06-09

Bray, W. Donald

Metal working

Method of mechanical manufacture

Electrical device making

29830, 29854, 29846, 216 18, 216 20, 427 98, H01K 310

Patent

active

057618020

ABSTRACT:
A method for electrically interconnecting a first electrical conductor to a second electrical conductor through a via formed in an insulating layer disposed between the conductors. A refractory metal layer is formed over: an upper surface of the insulating layer; sidewalls of the insulating layer formed by the via; and, portions of the first electrical conductor exposed by the via. Gold is deposited on a portion of the refractory metal layer formed on the exposed portion of the first electrical conductor. The deposited gold has a planar surface and is preferably spaced from portions of the conductive layer disposed on the sidewalls of the insulating layer to provide an plating site. Additional gold is electroplated onto the electroplating site to fill the via to a level co-planar with the upper level of the insulating layer. A photoresist layer is formed over the co-planar surfaces of the insulating layer and the filled via. An opening is formed in the photoresist layer exposing a portion of the surface of the filled via. A conductive material is deposited onto the photoresist layer and through the opening onto the exposed portion of the surface of the filled via. The photoresist with the portions of the conductive material deposited thereon is lifted-off while leaving the portion of such conductive material deposited onto the exposed portion of the surface of the filled via.

REFERENCES:
patent: 5022960 (1991-06-01), Takeyama et al.
patent: 5363550 (1994-11-01), Aitken et al.
patent: 5526564 (1996-06-01), Ohshima et al.

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