Chemistry: electrical and wave energy – Processes and products
Patent
1983-06-28
1984-11-20
Tufariello, Thomas
Chemistry: electrical and wave energy
Processes and products
204224R, 204DIG7, C25D 502, C25D 508, C25D 1700
Patent
active
044837496
ABSTRACT:
Here are disclosed a method and apparatus for making it possible to plate specific parts of members to be plated to be high in the precision and quality even in minute area parts.
In highly integrated printed base plates and integrated circuit elements, it has been difficult to plate precious metals high in the specific conductivity precisely and uniformly in the required minute parts with a plating apparatus in order to control as much as possible the resistances and impedances in the respective terminals and contacts. Therefore, according to the present invention, in a jetting type plating apparatus jetting a plating liquid through a nozzle onto a specific part required to be plated of an object to be plated, a mask is brought into close contact with the periphery of the specific part opposed to the nozzle to form a sealed space around the nozzle by a closely enclosing means, the object to be plated is set at a distance adjacent to the nozzle tip, a voltage of a predetermined polarity is impressed to make the migration of metal ions by an electric field conspicuous, to make a plating treatment possible and the sealed space is held under a negative pressure to quickly suck and discharge the used plating liquid.
REFERENCES:
patent: 2987460 (1961-06-01), Mizia
patent: 3536594 (1970-10-01), Pritchard
patent: 4287029 (1981-09-01), Shimamura
patent: 4348267 (1982-09-01), Shimamura
Sonix Ltd.
Tufariello Thomas
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