Stepped mould inserts, high-precision stepped microstructure bod

Details Stepped mould inserts, high-precision stepped microstructure bod Stepped mould inserts, high-precision stepped microstructure bod

1995-06-06

1996-06-25

Gorgos, Kathryn

Electrolysis: processes, compositions used therein, and methods

Electroforming or composition therefor

Mold, mask, or masterform

205122, C25D 502

Patent

active

055296815

ABSTRACT:
The present invention concerns stepped mould inserts, a method of producing the same and high-precision stepped microstructure bodies moulded therewith. The present stepped mould inserts and method of producing the same are more simple than previous methods. The lithographically produced regions of a patterned resist layer, which are exposed by development on a flat plate, are filled with metal. The layer may be mechanically removed, down to a predetermined thickness. After the residues of the resist have been dissolved out, if necessary or desired, this operation is repeated from one to several times. The regions removed from the resist layer are filled with metal, covered and separated from the resist layer, thus providing a multistep metallic mould insert. High-precision microstructure bodies having a multistep structure are produced with the present stepped mould insert.

REFERENCES:
patent: 4124473 (1978-11-01), Lehmann et al.
patent: 4351653 (1982-09-01), Becker
patent: 5190637 (1993-03-01), Guckel
patent: 5234571 (1993-08-01), Noeker
patent: 5260175 (1993-11-01), Kowanz
IBM Technical Disclosure Bulletin, nr. 10, vol. 36, AN 9310423, Oct. 1993.

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