Electrically anisotropic elastomeric structure with mechanical c

Details Electrically anisotropic elastomeric structure with mechanical c Electrically anisotropic elastomeric structure with mechanical c

1995-04-18

1996-06-25

Elkins, Gary E.

Electrical connectors

Including elastomeric or nonmetallic conductive portion

Adapted to be sandwiched between preformed panel circuit...

29831, 29874, 29879, 439 67, H05K 114, H05K 310, H01R 909

Patent

active

055295045

ABSTRACT:
A microconnection device and a method of forming such a device include providing an array of electrically interconnected conductors within through holes of an insulative flexible film. Preferably, each conductor has a microbump. Since the conductors are interconnected, the microbumps define a cluster for contact with a single contact, such as an input/output pad of a semiconductor device. In the preferred embodiment, the flexible film includes a cavity at the central region of the cluster, thereby enhancing the flexibility of the film. By applying a load force within the central region of the cluster, the flexible film is caused to bend in a manner to achieve load compliance and a lateral scrub for removing contaminants, oxides and the like at the interface of the microbumps and the contact. A top bump that is misaligned with the microbumps may be formed to ensure proper localization of the load force within the central region. Preferably, the flexible film includes an array of microconnection devices.

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Yamamoto et al., "Evaluation of New Micro-connection System Using Microbumps," 1993 International Symposium on Microelectronics, SPIE vol. 2105, pp. 370-378, (Nov. 1993).

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