Drill coordinate optimization for multi-layer printed circuit bo

Cutting by use of rotating axially moving tool – Processes – Bit detachable

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

36447402, 36447415, 408 2, 408 13, 408 16, B23B 3500, B23B 4100

Patent

active

055294413

ABSTRACT:
A system and method for optimizing drill coordinates in a multi-layer printed circuit board, to correct for interlayer shift during lamination. A set of test patterns, in the form of a cross formed by two orthogonal conductor lines, are defined at each corner of each layer in the same nominal location. Under ideal conditions, the test patterns of the layers in each corner are lined up one above the other, without any offset. A counter sinking tool is used to cut a conical bore in the location of the test patterns, so that every test pattern cross is interrupted in four places, generating a four segment pattern in each layer. A high resolution camera is placed above the countersunk bore to form a single image of the exposed segment edges of all the test patterns exposed by the bore. The image is analyzed to determine the amount of shift of each layer. If all patterns are perfectly concentric, all crosses are perfectly aligned. By measuring the shift of each pattern from the nominal position, the amount of shift in each layer is determined. The process is repeated for the test patterns at each corner of the board, and the resultant layer shift data is processed to optimize the drilling pattern for the board.

REFERENCES:
patent: 4708545 (1987-11-01), Fujii et al.
patent: 4790694 (1988-12-01), Wilent et al.
patent: 5111406 (1992-05-01), Zachman et al.
patent: 5347462 (1994-09-01), Okuda et al.
"Multilayer Measuring/Drilling Machine MLV 92," Wessel GmbH, Germany.
Proposal for Feature Measurement Drilling machine, Dynamotion Corporation, 1991.
"CNC-Precision Drilling and Routing Machine LBA 805," Wessel GmbH, Germany.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Drill coordinate optimization for multi-layer printed circuit bo does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Drill coordinate optimization for multi-layer printed circuit bo, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Drill coordinate optimization for multi-layer printed circuit bo will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2184838

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.