Bump electrode structure to be coupled to lead wire in semicondu

Details Bump electrode structure to be coupled to lead wire in semicondu Bump electrode structure to be coupled to lead wire in semicondu

1994-07-22

1995-08-15

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Wire contact, lead, or bond

257781, H01L 2348, H01L 2944, H01L 2952, H01L 2960

Patent

active

054422418

ABSTRACT:
A semiconductor device comprising a semiconductor substrate having an insulating film thereon, a pad electrode provided on the insulating film, first and second bumps disposed on the pad electrode to provide a gap therebetween, and a lead wire coupled to the gap. In the structure, each of the first and second bumps has a straight or mushroom bump structure.

REFERENCES:
patent: 3462349 (1969-08-01), Gorgenyi
patent: 4742023 (1988-05-01), Hasegawa
patent: 5136363 (1992-08-01), Endo et al.
patent: 5194931 (1993-03-01), Araki

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