Method for locally enhancing electroplating rates

Details Method for locally enhancing electroplating rates Method for locally enhancing electroplating rates

1979-05-08

1980-08-12

Tufariello, T. M.

Chemistry: electrical and wave energy

Processes and products

204224R, 204DIG7, C25D 502, C25D 516

Patent

active

042171830

ABSTRACT:
A method for high resolution maskless electroplating is described. Preferential plating results from exposing those regions where enhanced plating is sought to a collimated energy beam. Such exposure can produce an enhancement in the plating rate of 10.sup.3, which is sufficient to eliminate the necessity of masking the surface.

REFERENCES:
patent: 3013955 (1961-12-01), Roberts
patent: 3322231 (1967-05-01), Gourney
patent: 3345274 (1967-10-01), Schmidt
patent: 3345275 (1967-10-01), Schmidt
patent: 3506545 (1970-04-01), Garwin et al.
patent: 3529961 (1970-09-01), Schaefer et al.
patent: 3810829 (1974-05-01), Fletcher
patent: 3848104 (1974-11-01), Locke
patent: 4024029 (1977-05-01), Rain et al.
patent: 4161436 (1979-07-01), Gould
Ultrasonics, Mar. 1975, pp. 79-82.
Electrochemical Society Abstract, No. 161, by M. P. Drake, vol. 78-2, p. 434 (1978).
Electrochimica Acta., vol. 118, p. 619 (1973).
Electrochemical Society Abstract, No. 286, by B. L. Bestel et al., vol. 77, No. 2, p. 759 (1977).
Proceedings of the IEEE, vol. 57, No. 1, p. 21, Jan. 1969.
Insulation/Circuits, pp. 23, 24, Jul. 1978.

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