Package for a charge-coupled device with temperature dependent c

Details Package for a charge-coupled device with temperature dependent c Package for a charge-coupled device with temperature dependent c

1985-05-31

1988-04-19

Munson, Gene M.

Electric heating

Microwave heating

Tunnel furnace

357 24, 357 51, 357 80, 357 83, 219209, H01L 2356, H01L 2334, H01L 2702, H01L 2978

Patent

active

047393823

ABSTRACT:
A charge-coupled device package comprises a substrate of dielectric material and a charge-coupled device die mounted on one main face of the substrate. The substrate is placed in heat exchange relationship with a cold sink, such as a bath of LN.sub.2. A temperature sensor senses the temperature at a location on the main face that is in close proximity ot the die. A film resistor is adhered to the opposite main face of the substrate and receives a current that depends upon the temperature sensed by the sensor.

REFERENCES:
patent: 3431392 (1969-03-01), Garland et al.
patent: 3440407 (1969-04-01), Goltsos et al.
patent: 3714527 (1973-01-01), Schmidt
patent: 3872418 (1975-03-01), Plough et al.
patent: 3887785 (1975-06-01), Ahlport
patent: 4009482 (1977-02-01), Nakata
patent: 4329701 (1982-05-01), Brenneman
patent: 4374316 (1983-02-01), Inamori et al.
patent: 4422091 (1983-12-01), Liu

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