Grounding clip structure of I/O card

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Patent

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Details

361737, 439946, H05K 900

Patent

active

054900433

ABSTRACT:
An I/O card (1) includes a rectangular frame (10) sandwiched between a top cover (11) and a bottom cover (13). Connector means (16, 18) are positioned at the ends of the I/O card (1) to form an in-and-out interface, and is mounted on a PC board (28) in the I/O card (1). A pair of top and bottom grounding clips (40, 30) are respectively attached on two opposite sides of the frame (10) and electrically and mechanically engage the top surface (29) and the bottom surface (27) of the inner PC board (28), respectively, wherein both grounding clips (30, 40) can be pre-assembled with the frame (10) and the bottom cover (13) as a semi-finished product which is delivered to an I/O card manufacturer who assembles the internal PC board (28) and the associated interface connectors (16, 18) to such pre-assembly without any interference from either of the grounding clips (30, 40) and successively places a top cover (11) thereon to complete the final product. In this situation, the top grounding clip (40) can be deformably depressed downward by the top cover (11) to electrically and mechanically contact the top surface (29) of the internal PC board (28) for grounding.

REFERENCES:
patent: 5235492 (1993-08-01), Humbert et al.
patent: 5319516 (1994-06-01), Perkins
patent: 5333100 (1994-07-01), Anhalt et al.
patent: 5339222 (1994-08-01), Simmons et al.

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