Method of fabricating thin film circuits with high density circu

Details Method of fabricating thin film circuits with high density circu Method of fabricating thin film circuits with high density circu

1995-01-20

1996-02-06

Fourson, George

Fishing, trapping, and vermin destroying

437180, 437182, H01L 21283, H01L 2160

Patent

active

054895510

ABSTRACT:
A method of fabricating a high density thin film circuit includes the step of bonding a high density connector having a plurality of electrical connection lines with a wafer having a plurality of electrical contact pads arranged in a pattern with a pitch less than about 100 .mu.m so that an electrical coupling is formed between the wafer contact pads and connector electrical connection lines. The step of forming the electrical coupling comprises pyrolysis of an adhesive disposed between the high density connector and said wafer. The electrical coupling between the contact pads and electrical connection lines is formed by directing a laser beam on the area in which the electrical coupling is to be formed so as to cause thermal decomposition of the adhesive to form a conductive carbon material; portions of the wafer contact pads and the connector electrical connection lines are also welded to the conductive carbon material.

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patent: 5303074 (1994-04-01), Salisbury
patent: 5316204 (1994-05-01), Takehashi et al.
patent: 5349238 (1994-09-01), Ohsawa et al.
G. Kramer, "Thin-Film-Transistor Switching Matrix for Flat-Panel Displays," Proceeding of the S.I.D., vol. 16/3, Third Quarter 1975, pp. 152-158.

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