Method for the manufacture of tubular bodies of semiconductor ma

Plastic and nonmetallic article shaping or treating: processes – Gas or vapor deposition of article forming material onto...

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427 91, B01J 1730, B01J 1732

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active

039794903

ABSTRACT:
For the manufacture of tubular bodies of semiconductor material, particularly of silicon, by the precipitation of a layer in the form of a hollow cylinder on a rod or tube-shaped, electrically heated carrier in a reaction gas suitable for the deposition of the semiconductor in question, with subsequent separation of the semiconductor layer from the carrier, the carrier is differentially heated in such a manner that the generated hollow-cylinder layer is given an annular, bead-like reinforcement; the separation of the tube obtained into parts is achieved by a cut made within the reinforcement.

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patent: 3014791 (1961-12-01), Benzing et al.
patent: 3139363 (1964-06-01), Baldrey
patent: 3438810 (1969-04-01), Benedict et al.
patent: 3576932 (1971-04-01), Biddulph
patent: 3620827 (1971-11-01), Emmasingel
patent: 3686378 (1972-08-01), Dietze
patent: 3746496 (1973-07-01), Dietze et al.
patent: 3747559 (1973-07-01), Dietze
patent: 3751539 (1973-08-01), Reuschel et al.

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