Process for chemical-mechanical polishing of III-V semiconductor

Adhesive bonding and miscellaneous chemical manufacture – Methods

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29580, 156 6, 156 17, 252 792, 252 794, H01L 21304

Patent

active

039792390

ABSTRACT:
Method for combined chemical-mechanical polishing of III - V semiconductor planar surfaces by applying a weak aqueous hydrochloric acid solution in combination with an aqueous source of chlorine to the surface to be polished while simultaneously mechanically polishing the surface.

REFERENCES:
patent: 3342652 (1967-09-01), Reisman et al.
patent: 3615955 (1971-10-01), Regh et al.
patent: 3775201 (1973-11-01), Basi et al.
patent: 3791948 (1974-02-01), Dixon et al.
patent: 3869323 (1975-03-01), Basi
patent: 3869324 (1975-03-01), Basi et al.

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