Method for packaging semiconductor devices

Details Method for packaging semiconductor devices Method for packaging semiconductor devices

1974-08-29

1976-09-07

Tupman, W.

Metal working

Method of mechanical manufacture

Assembling or joining

29580, 29588, 29590, 427 82, 427240, 427385, B01J 1700

Patent

active

039785785

ABSTRACT:
An improved method of packaging semiconductor devices and dice which comprises coating a semiconductor wafer with a polyimide film, etching selected areas of the polyimide film from the surface of the wafer, separating the wafer into a plurality of semiconductor dice wherein each of the dice have electrical contacts to circuits within the device and making ohmic electrical connection with the electrical contacts on the dice.

REFERENCES:
patent: 3478420 (1969-11-01), Grimes et al.
patent: 3496631 (1970-02-01), Chen
patent: 3584264 (1971-06-01), Melouski et al.
patent: 3610870 (1971-10-01), Sakamoto
patent: 3706840 (1972-12-01), Moyle et al.
patent: 3708870 (1973-01-01), Goodman
patent: 3762039 (1973-10-01), Douglass et al.
patent: 3903590 (1975-09-01), Yokogawa

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