Thermosetting resin composition comprising epoxy compound and re

Details Thermosetting resin composition comprising epoxy compound and re Thermosetting resin composition comprising epoxy compound and re

1979-07-05

1981-07-14

Anderson, Harold D.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

260 37EP, 260 37N, 260 38, 260 457P, 525502, 525504, 528117, 528173, 528183, 528322, 528341, 528345, C08L 6304, C08G 7310, C08G 7312

Patent

active

042787807

ABSTRACT:
A thermosetting resin composition suitable for use as a molding material comprising (a) a reaction product mixture obtained by preferably reacting 1 mole of a dicarboxylic acid anhydride having ethylenic carbon-carbon double bond such as maleic anhydride with 2-20 moles of a diamine such as 4,4'-diaminodiphenylmethane in a molten state and (b) an epoxy compound having more than one 1,2-epoxy group on the average gives a cured product excellent in heat resistance, etc., when cured with heating at a temperature of 150.degree. to 200.degree. C.

REFERENCES:
patent: 3562223 (1971-02-01), Bargain et al.
patent: 3725345 (1973-04-01), Bargain
patent: 3730948 (1973-05-01), Akiyama et al.

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