Heat activatable adhesive with improved temperature resistance

Details Heat activatable adhesive with improved temperature resistance Heat activatable adhesive with improved temperature resistance

1981-12-15

1984-02-07

Welsh, Maurice J.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

525176, 525183, 525185, 525187, 525418, 525420, 525438, 525453, C08L 7504

Patent

active

044304790

ABSTRACT:
A heat activatable thermoplastic adhesive composition is described which comprises (a) a thermoplastic polymer, (b) an organic polymer having a plurality of functional groups available for crosslinking, and (c) a crosslinking agent capable of reacting with (b). The adhesive compositions exhibit delayed tack and improved temperature resistance.

REFERENCES:
patent: 2653880 (1953-09-01), Hendricks et al.
patent: 2653881 (1953-09-01), Vetter
patent: 3639655 (1972-02-01), Jones
patent: 3723568 (1973-03-01), Hoeschele
patent: 3931077 (1976-01-01), Uckigaki et al.
patent: 3975457 (1976-08-01), Chang et al.
patent: 4048253 (1977-09-01), Ooba et al.
patent: 4059715 (1977-11-01), Pletcher
patent: 4066600 (1978-01-01), Pletcher et al.
patent: 4116937 (1978-09-01), Jones et al.
patent: 4122073 (1978-10-01), Georgoudis
patent: 4124571 (1978-11-01), Georgoudis
patent: 4137364 (1979-01-01), Ball et al.
patent: 4144219 (1979-03-01), Malloy

Affiliated with

Also associated with

Rating

Heat activatable adhesive with improved temperature resistance does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heat activatable adhesive with improved temperature resistance, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat activatable adhesive with improved temperature resistance will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2162637