Semiconductor apparatus

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357 69, 357 75, H01L 2302

Patent

active

046927891

ABSTRACT:
In a semiconductor apparatus for controlling a large current at a high speed, a lead conductor coupled to a control electrode of a semiconductor device sealed in a package comprises a conductor plate having a width equal to or greater than one side or a diameter of the semiconductor device, thereby decreasing impedance against a high-frequency input signal.

REFERENCES:
patent: 3710202 (1973-01-01), Leidich et al.
patent: 3893159 (1975-07-01), Martin
patent: 4297722 (1981-10-01), Nagahama et al.
patent: 4518982 (1985-05-01), Du Bois et al.
patent: 4527010 (1985-07-01), Anazawa et al.

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