Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Patent
1999-01-05
2000-12-12
Tsai, Jey
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
438612, 438613, 438614, 2281804, 22818022, H01L 2144, H01L 2148, H01L 2150
Patent
active
061597694
ABSTRACT:
An apparatus and a method for forming a substrate having a palladium metal layer over at least one contact point of the substrate and having a flexible conductive polymer bump, preferably a two-stage epoxy, on the palladium plated contact point. The present invention also relates to assemblies comprising one or more of these substrates.
REFERENCES:
patent: 4182781 (1980-01-01), Hooper et al.
patent: 4970571 (1990-11-01), Yamakawa et al.
patent: 5196371 (1993-03-01), Kulesza et al.
patent: 5258577 (1993-11-01), Clements
patent: 5468681 (1995-11-01), Pasch
patent: 5468995 (1995-11-01), Higgins, III
patent: 5478007 (1995-12-01), Marrs
patent: 5485038 (1996-01-01), Licari et al.
patent: 5486721 (1996-01-01), Herklotz et al.
patent: 5489804 (1996-02-01), Pasch
patent: 5491612 (1996-02-01), Nicewarner, Jr.
patent: 5493437 (1996-02-01), Lebby et al.
patent: 5521432 (1996-05-01), Tsuji et al.
patent: 5561320 (1996-10-01), Abbott et al.
patent: 5674780 (1997-10-01), Lytle et al.
Akram Salman
Farnworth Warren M.
Micro)n Technology, Inc.
Tsai Jey
Zarneke David A.
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