Semiconductor device having glass and metal package

Details Semiconductor device having glass and metal package Semiconductor device having glass and metal package

1979-09-04

1982-09-14

James, Andrew J.

357 73, 357 68, 357 81, H01L 2302, H01L 2312, H01L 2330

Patent

active

043498310

ABSTRACT:
A semiconductor package of low cost is described having a flat base to which is attached a semiconductor subassembly which is enclosed by a glass housing adhesively bonded to the base without the necessity for a compression glass-to-metal seal. An electrode is provided which extends through the glass housing to contact the semiconductor subassembly, a similar seal being provided between the electrode and the glass housing. Low residual stress soft solder interfaces are provided to the semiconductor element.

REFERENCES:
patent: 2868862 (1959-01-01), Petri
patent: 2881369 (1959-04-01), Carman
patent: 2956160 (1960-10-01), Sharpless
patent: 2975928 (1961-03-01), Roovers
patent: 3223903 (1965-12-01), Solomon
patent: 3265805 (1966-08-01), Carlan et al.
patent: 3501680 (1970-03-01), Martin et al.
patent: 3515955 (1970-06-01), Butenschow
patent: 3560180 (1971-02-01), Merat
patent: 3735211 (1973-05-01), Kapnias
patent: 3760237 (1973-09-01), Jaffe
patent: 3831067 (1974-08-01), Wislocky et al.
patent: 4159221 (1979-06-01), Schuessler
patent: 4233620 (1980-11-01), Darrow et al.
patent: 4249034 (1981-02-01), Fichot et al.

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