Optical interconnections for integrated circuits

Details Optical interconnections for integrated circuits Optical interconnections for integrated circuits

1987-09-24

1989-05-30

LaRoche, Eugene R.

Radiant energy

Ionic separation or analysis

Static field-type ion path-bending selecting means

357 30G, 357 30FO, 357 30M, 250211J, 25037008, 25037014, 250332, H01L 2714, H01L 3100, H01L 4014, H01L 2500

Patent

active

048355950

ABSTRACT:
An optical interconnection in a semiconductor integrated circuit includes an opaque coating provided on a surface of the integrated circuit chip. The opaque coating has therein an opening which is positioned above a light receiving element incorporated in the chip and is filled with a transparent material layer. The transparent layer may have a lens action and/or a wavelength-selectivity.

REFERENCES:
patent: 4270135 (1981-05-01), Schlegel et al.
patent: 4321611 (1982-03-01), Conti
patent: 4513305 (1985-04-01), Bloss, III et al.
patent: 4689652 (1987-08-01), Shimada et al.
patent: 4703337 (1987-10-01), Yamazaki
Goodman et al., "Optical Interconnections for VLSI Systems", Proceedings of the IEEE, vol. 72, No. 7, Jul. 1984, pp. 850-865.

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