Thin film forming method through sputtering and sputtering devic

Details Thin film forming method through sputtering and sputtering devic Thin film forming method through sputtering and sputtering devic

1986-04-15

1987-09-08

Niebling, John F.

Chemistry: electrical and wave energy

Processes and products

Vacuum arc discharge coating

20419211, 20419212, 204298, C23C 1434

Patent

active

046922300

ABSTRACT:
A method for forming a thin film wherein plural targets of different materials are alternately sputtered througth the switching of the electric powers supplied thereto, the particles produced from the sputtering are ionized and thereafter deposited on a substrate. This method provides an alloy thin film, compound thin film or multi-layer thin film of any composition and enhances adhesion among the particles. A sputtering device for practicing this method is also disclosed.

REFERENCES:
patent: 4021277 (1977-05-01), Shirn et al.
patent: 4147573 (1979-04-01), Morimoto
patent: 4252626 (1981-02-01), Wright et al.
patent: 4389299 (1983-06-01), Adachi et al.
patent: 4444635 (1984-04-01), Kobayashi et al.
patent: 4591417 (1986-05-01), Kaiser et al.

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