Method of producing a flat LED panel display

Details Method of producing a flat LED panel display Method of producing a flat LED panel display

1986-09-15

1988-10-04

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437226, 437904, 437905, 437 51, 357 55, 357 17, 357 19, 148DIG28, H01L 2715, H01L 3300

Patent

active

047756454

ABSTRACT:
A flat LED panel display with LED elements arranged in a high density and a method of producing such a display are disclosed. A conductive layer is deposited on a ceramic substrate and bonded to one surface of an LED wafer by a conductive paste. A plurality of electrodes are arranged on the other surface of the LED wafer in rows and columns to define a two-dimensional pattern. Slits are formed along the rows or the columns each to a depth which extends from the other surface of the LED wafer to the ceramic substrate. Other slits are formed perpendicular to the first-mentioned slits each with a depth which extends from the other surface of the LED wafer to a position deeper than it but short of the ceramic substrate.

REFERENCES:
patent: 4236296 (1980-12-01), Woolhouse et al.
patent: 4275404 (1981-06-01), Cassiday et al.
patent: 4538342 (1985-09-01), Camlibel et al.
Tanabe et al., "High Accuracy Die Bonding Technology for LED Array", 35th Electronic Components Conference, N.Y., U.S.A.: IEEE 1985, pp. 460-464 of 516 p.
Wickenden, "High-Resolution LED Display for Avionic Application", GEC Journal of Science & Tech., vol. 46, No. 2, 1980, pp. 91-95.

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