Resinous copolymer insulating compositions

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Polymers from only ethylenic monomers or processes of...

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525117, 526251, 526293, 526259, 526262, 526271, 526284, 526300, 524548, 523406, C08F22230, C08F22400, C08F22606

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043496512

ABSTRACT:
A water soluble addition copolymer is formed by reaction admixing a monomer having a pendant vinyl group attached to at least one ring structure selected from the group consisting of nitrogen containing heterocyclic ring structures and aromatic ring structures and their mixtures, and a monomer selected from the group consisting of maleic anhydride, fumaronitrile, tetracyanoethylene, maleimide and their mixtures, where such addition copolymer can be used alone, as curable an insulating coating composition, or can be added to a resin, to form a curable resinous insulating coating composition.

REFERENCES:
patent: 2417608 (1947-03-01), Mowry
patent: 2710870 (1955-06-01), Lawson
patent: 3642730 (1972-02-01), Amiard et al.
patent: 3721724 (1972-03-01), Uebele et al.
patent: 4011282 (1977-03-01), Bacskai
patent: 4026862 (1977-05-01), Smith et al.
patent: 4077975 (1978-03-01), Trofimov et al.
patent: 4145375 (1979-03-01), Cutter et al.
patent: 4160792 (1979-07-01), Fava
patent: 4200720 (1980-04-01), Evani et al.
patent: 4243784 (1981-01-01), Akima et al.

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