Method of making a multilayer molded plastic IC package

Details Method of making a multilayer molded plastic IC package Method of making a multilayer molded plastic IC package

1988-06-29

1989-05-30

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437220, 437224, 174 522, 26427211, H01L 2128

Patent

active

048351202

ABSTRACT:
A multi-layered molded plastic package for encapsulating an integrated circuit is described. The package includes a carrier having a double-layered metal plate which are separated by an adhesive coated insulation tape. A second insulating tape layer is used to bond externally extending leads onto one of the metal plates. Power and ground connections from the terminal of the integrated circuit are made to each of the plates, respectively, as are the power and ground lead connections to the two plates. The power and ground planes remove the requirement for direct physical connection between the power and ground terminals of the integrated circuit and their respective leads.

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