Packaging method of a circuit for an electronic watch

Details Packaging method of a circuit for an electronic watch Packaging method of a circuit for an electronic watch

1976-05-05

1978-05-02

Hall, Carl E.

Metal working

Method of mechanical manufacture

Electrical device making

29177, 29628, 58 23A, 174 52PE, H01R 4302, H05K 332

Patent

active

040866963

ABSTRACT:
A method of manufacturing a circuit assembly for an electronic watch without use of a printed circuit board comprises bonding an IC chip to the surface of a lead frame and then wire-bonding the IC chip terminal pads to respective bonding conductors. The lead frame is superposed on a thermoplastic resin base plate and preselected parts of the base plate are melted so as to fix and connect together the lead frame and base plate as the melted parts harden. The IC chip and wire-bond connections are then potted with synthetic resin to form the completed circuit assembly. A thermoplastic resin cover plate may be disposed atop the lead frame except for the region of the IC chip and wire-bond connection and fixed to the head frame during the melting step.

REFERENCES:
patent: 3791025 (1974-02-01), Guarjado
patent: 3863436 (1975-02-01), Schwarzschild
patent: 3981138 (1976-09-01), Levine et al.
patent: 3999285 (1976-12-01), Lewis

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