Boots – shoes – and leggings
Patent
1995-06-13
1997-03-04
Gordon, Paul P.
Boots, shoes, and leggings
36447501, 425461, G06F 1900, G06G 764, G06G 766
Patent
active
056086377
ABSTRACT:
The present invention discloses a method for designing a profile extrusion die plate. In the present invention, a representation of a product made from a resin material and shaped by a die is provided. The representation illustrates a relationship between die swell of the resin, shear rate of the resin through the die, and the ratio of die land length of the die to die opening thickness of the die. From the representation, instances where the ratio of die land length to die opening thickness minimizes die swell of the resin is determined. Experimental data of the resin shaped by an experimental die is then obtained. The experimental data includes draw speed, shear rate, and die swell. The representation and the experimental data are then arranged into die design charts for die opening thickness and die opening width. The die design charts are then used to determine profile dimensions of a desired profile extrusion die.
REFERENCES:
patent: 4751651 (1988-06-01), Bryan
"Plastics Extrusion Operating Manual, An Introduction and Guide to Extrusion" by Allan L. Griff, Tenth Revised Edition, 1992, pp. 1-58.
Cycolac ABS Resin Design Guide, Date Unknown.
"Die Design Principles for Extrusion of Polymers", by Leonard Sansone, Society of Plastics Engineers Educational Seminars, Date Unknown.
Kakulavar Srinivasu
Wang Hsin-Pang
Dolan Robert J.
General Electric Company
Goldman David C.
Gordon Paul P.
Snyder Marvin
LandOfFree
Method for designing a profile extrusion die plate does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for designing a profile extrusion die plate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for designing a profile extrusion die plate will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2151520