Polishing agent used for polishing silicon wafers and polishing

Details Polishing agent used for polishing silicon wafers and polishing Polishing agent used for polishing silicon wafers and polishing

1996-12-16

1997-09-16

Green, Anthony

Compositions: coating or plastic

Coating or plastic compositions

Polishes

51308, C09G 102

Patent

active

056675674

ABSTRACT:
A polishing agent used for polishing a silicon wafer is composed of a colloidal silica polishing agent containing an ethyl silicate monomer and/or an ethyl silicate polymer. Even when the polishing agent is used with a rigid polishing pad, it is able to provide a polished wafer having an excellent flatness and whose surface has a roughness comparable to that obtained by the conventional final polishing process.

REFERENCES:
patent: 4462828 (1984-07-01), Otsuki
patent: 4579564 (1986-04-01), Smith
patent: 4842837 (1989-06-01), Shimizu et al.
patent: 5226930 (1993-07-01), Sasaki
patent: 5352277 (1994-10-01), Sasaki
J. of Non-Crystalline Solids, 149 (Nov. 1992) 161-178, "Particle morphology and chemical microstructure of colloidal silica spheres made from alkoxysilanes", Blaaderen and Kentgenz.
Japanese Industrial Standard K 6301 "Spring Type Hardness Test (A and C)". No Date.

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